B.Voc Syllabus – Electrical

B.VOC. in Electrical

Model Curriculum for B.Voc/ D.Voc in Electrical

All India Council for Technical Education Nelson Mandela Marg, New Delhi

1.     Introduction

All India Council for Technical Education (AICTE) Ministry of HRD, Government of India has introduced Entrepreneurship oriented Skill development courses of B.Voc/D.Voc/Skill Diploma. These courses will be run by AICTE approved institutes by using available infrastructure and facilities. In these courses the institute will conduct general education content and sector specific skills will be imparted by Skill Knowledge Providers/ Training Providers/ Industries.

1.1 Key Features:

Objectives

  • To provide judicious mix of skills relating to a profession and appropriate content of General Education.
    • To ensure that the students have adequate knowledge and skills, so that they are work ready at each exit point of the programme.
    • To provide flexibility to the students by means of pre-defined entry and multiple exit points.
    • To integrate NSQF within the Diploma, undergraduate level of higher education to enhance employability of the students and meet industry requirements.  Such student apart from meeting the needs of local and national industry are also expected to be equipped to become part of the global workforce.
    • To provide vertical mobility to students admitted in such vocational courses.
    • The certification levels will lead to Diploma/Advanced Diploma/B. Voc. Degree in Electronic Manufacturing Services and will be offered by  respective affiliating University/Board of Technical Education.
    • Students may be awarded Level Certificate/Diploma/Advance Diploma /Degree as out-lined in the Table below:
Award Duration after class XII Corresponding NSQF level
Diploma 1 Year 5
Advance Diploma 2 Years 6
B.Voc Degree 3 Years 7

2.  Course Objectives

After successfully completing the vocational course, the student would have acquired relevant appropriate and adequate technical knowledge together with the professional skills and competencies in the field of Electronics Manufacturing Service so that he/she is properly equipped to take up gainful employment in this Vocation. Thus he/she should have acquired:-

A.  Understanding of

  • The relevant basic concepts and principles in basic science subjects (Physics, Chemistry and Mathematics) so that he/she is able to understand the different vocational subjects.
    • The basic concepts in engineering drawing.
    • The concepts, principles of working of basic electronic devices and circuits.
    • The knowledge of testing procedure of components and circuits by making use of different test instruments.
    • The procedure of making P.C.B.
    • The concepts and principles used in Radio/Audio/Video Systems and Communication devices and its maintenance.

B.  Adequate Professional Skills and Competencies in

  • Testing different electronic components.
    • Testing the performance of electronic circuits.
    • Locating the fault at component level and at the stage level.

C.  A Healthy and Professional Attitude so that He/She has

  • An analytical approach while working on a job.
    • An open mind while locating/rectifying faults.
    • Respect for working with his/her own hands.
    • Respect for honesty, punctuality and truthfulness

D.     NSQF compliant skills in Qualification developed by sector skill council in Electronic sector

  • Course Structure

The course will consist of combination of practice, theory and hands on skills in the electronics sector.

Curriculum

The curriculum in each of the years of the programme would be a suitable mix of general education and skill components.

Skill Components:

  • The focus of skill components shall be to equip students with appropriate knowledge, practice and attitude, to become work ready. The skill components will be relevant to the industry as per its requirements.
  • The curriculum will necessarily embed within itself, National Occupational Standards (NOSs) of specific job roles within the industry. This would enable the students to  meet the learning outcomes specified in the NOSs.
  • The overall design of the skill development component along with the job roles selected will be such that it leads to a comprehensive specialization in few domains.
  • The curriculum will focus on work-readiness skills in each of the year of training.
  • Adequate attention will be given in curriculum design to practical work, on the job training, development of student portfolios and project work.

General Education Component:

  • The general education component adhere to the normal senior secondary and university standards. It will emphasize and offer courses which provide holistic development. However, it will not exceed 40% of the total curriculum.
  • Adequate emphasis is given to language and communication skills.

The curriculum is designed in a manner that at the end of each year after class Xth students can meet below mentioned level descriptors of NSQF:

Level Process required Professional Knowledge Professional skill Core skill Responsibility
        Level 5       Job that requires well developed skill, with clear choice of procedures in familiar context     Knowledge of facts, principles, processes and general concepts, in a field of work or study   A range of cognitive and practical skills required to accomplish tasks and solve problems by selecting and applying basic methods, tools materials and information   Desired mathematical skill, understanding of social, political and some skill of collecting and organizing information, communication.     Responsibility for own work and learning and some responsibility for other’s works and learning
        Level 6   Demands wide range of specialized technical skill, clarity of knowledge and practice in broad range of activity involving standard/ non-standard practices       Factual and theoretical knowledge in broad contexts within a field of work or study     A range of cognitive and practical skills required to generate solutions to specific problems in a field of work or study Reasonably good in mathematical calculation, understanding of social, political and reasonably good in data collecting organizing information, and logical communication     Responsibility for own work and learning and full responsibility for other’s works and learning
        Level 7   Requires a command of wide ranging specialized theoretical and practical skill, involving variable routine and non- routine context     Wide ranging, factual and theoretical knowledge in broad contexts within a field of work or study   Wide range of cognitive and practical skills required to generate solutions to specific problems in a field of work or study Good logical and mathematical skill understanding of social political and natural environment good in collecting and organizing information, communication and presentation skill       Full responsibility for output of group and development

Curriculum

Level Code Educational Component Credit Marks
                5   Semester I Theory
5.GV.01 Electronic Measurement and Instrumentation -I 3 50
  5.GV.02 Identification of Components, Tools, SOP & Work Instructions-I   3   50
5.GV.03 Tools, Equipment & Safety Measures –I 3 50
5.GV.04 Soldering & De-Soldering of Components –I 3 50
Lab/Practical
5.VP.01 Identification of Components, Tools, Equipment and its working –Lab   1.5   50
5.VP.02 Electronic Measurement and Instrumentation -I –Lab 1.5 50
On-Job-Training (OJT)/Qualification Packs
Embedded Software Engineer (ELE/Q1501)     (Any one)     15     200
Security System Service Engineer (ELE/Q4610)
Systems Analyst (ELE/Q8701)
      5   Semester II Theory
5.GV.05 Electronic Measurement and Instrumentation –II 3 50
  5.GV.06 Identification of Components, Tools, SOP & Work Instructions-II   3   50
5.GV.07 Tools, Equipment & Safety Measures –II 3 50
  5.GV.08 Soldering & De-Soldering of Components & Emergency actions II   3   50
Level Code Educational Component Credit Marks
  Lab/Practical
5.VP.03 Soldering & De-Soldering of Components-Lab 1.5 50
5.VP.04 Electronic Measurement and Instrumentation -II (Lab) 1.5 50
On-Job-Training (OJT)/Qualification Packs
Smartphone Assembly Inspector (ELE/Q4001)   (Any one)   15   200
Business Development Executive (ELE/Q1101)
            6   Semester I Theory
6.GV.01 Fault analysis & Repairs 3 50
6.GV.02 Good Manufacturing Concept & Practices – I 3 50
6.GV.03 Electronics Devices Circuit –I 3 50
6.GV.04 Electronics System Packaging and Manufacturing 3 50
Lab/Practical
6.VP.01 Electronics Devices Circuit –I Lab 1.5 50
6.VP.02 Fault analysis & Repairs – Lab 1.5 50
On-Job-Training (OJT)/Qualification Packs
Field Engineer RACW (ELE/Q3105)   (Any one)   15   200
Security System Service Engineer (ELE/Q4610)
Pre-Sales Solar Technical Support Engineer(ELE/Q5602)
          6   Semester II Theory
6.GV.05 Good Manufacturing Concepts Practices–II 3 50
6.GV.06 Manufacturing & Quality Norms 3 50
6.GV.07 Good Manufacturing Concepts & Practices–III 3 50
6.GV.08 Electronics Devices Circuit –II 3 50
Lab/Practical
6.VP.03 Electronics Devices Circuit –II Lab 1.5 50
6.VP.04 Manufacturing Practices 1.5 50
On-Job-Training (OJT)/Qualification Packs
Purchase Executive (ELE/Q5701) Any one)   15 200
Quality Engineer (ELE/Q7901)  
7   Semester I Theory 7.GV.01     Valuation & Storage                                                                            3             50
       
  7.GV.02 Shelf Life, Ware House Operations Management & Material Transactions   3   50
Level Code Educational Component Credit Marks
  7.GV.03 Industrial Electronics Product Design 3 50
7.GV.04 Pre-Production Activities 3 50
Lab/Practical
7.VP.01 Pre-Production Activities-Lab 1.5 50
7.VP.02 Valuation & Storage-Lab 1.5 50
On-Job-Training (OJT)/Qualification Packs
Product Engineer (ELE/Q4201)   (Any one)   15   200
Incoming QC Technician (ELE/Q4401)
Assembly Supervisor (ELE/Q6305)
    7   Semester II Theory
7.GV.05 Entrepreneurship/Accounting/Management 3 100
Lab/Practical 7.GV.06     Project Work                                                                                      12           200
       
On-Job-Training (OJT)/Qualification Packs
FPGA Design Engineer (ELE/Q8201)   (Any one)   15   200
Sales Executive-Consumer Electronics (ELE/Q3201)

Detailed Curriculum

Level 5 (Semester I)

(5.GV.01) Electronic Measurements and Instrumentation-I

Unit, dimensions and standards: Scientific notations and metric prefixes. SI electrical units, SI temperature scales, Other unit systems, dimension and standards. Measurement

Errors: Gross error, systematic error, absolute error and relative error, accuracy, precision, resolution and significant figures, Measurement error combination, basics of statistical analysis. PMMC instrument, galvanometer, DC ammeter, DC voltmeter, series ohm meter Transistor voltmeter circuits, AC electronic voltmeter, current measurement with electronic instruments, probes Digital voltmeter systems, digital multimeters, digital frequency meter system.

Reference Books:

1. Electronic Measurement & Instrumentation, J.G. Joshi, Khanna Publishing House

(5.GV.02) Identification of Components, Tools, SOP & Work Instructions-I

  1. Main components & modules/ sub-assemblies of electronic equipment
    1. Control Panel (System Controller)
    1. Keypads
    1. Door and Window Contacts
    1. Motion Detectors
    1. Glass Break Detection
    1. Smoke Detectors
    1. Heat Sensors
    1. Carbon Monoxide Detectors
    1. Water Detectors (or Water Bug)
    1. Temperature Sensors
    1. Capacitance switches / control push buttons & rotary switches
  • Digital Electronics
    • Electronic controls in a common way
    • Counters
    • Flip- flops
    • Logic gates
    • Multiplexers
    • Decoders
  • Concept of Amplification factor, Gain & Signal distortion
  • Protocols like TCP/TP for communication purpose and for digital networks & circuits.

(5.GV.03) Tools, Equipment and Safety Measures-I

  1. Cables & Connectors
    1. Non-Metallic Sheathed Cable
    1. Un grounded & Grounded Power Supply Cable
    1. Metallic Sheathed Cable
    1. Multi-Conductor Cable
    1. Coaxial Cable
  • Unshielded Twisted Pair Cable
    • Shielded twisted pair cable
    • Ribbon Cable
    • Armoured & Unarmoured Cable
    • Twin-Lead Cable
    • Twin axial Cable
    • Optical fiber cable
    • Connectors
  • ESD Clothing
    • What to wear, how to wear

(5.GV.04) Soldering & De-Soldering of Components-I

  1. Soldering & De Soldering of Basic Components
    1. Soldering Tools
    1. Different types of Soldering Guns related to Temperature and wattages, types of tips
    1. Solder materials and their grading
    1. Soldering and De Soldering Stations and their Specifications
    1. Preparing Component for Soldering
    1. PCB Applications
    1. Types of PCB
    1. Soldering Basic Components on PCB
    1. De soldering Basic Components
    1. Safety precautions while Soldering & De soldering
    1. Check for cold continuity of PCB
    1. Identification of loose/dry solder, broken tracks on printed wire assemblies & discrete components mounted circuit boards
    1. Join the broken PCB track and test
    1. De soldering using Pump and wick
    1. Introduction of SMD Components

(5.VP.01) Identification of Components, Tools, SOP & Work Instructions-I – Lab

  1. Identification & working of various electronic components
  2. Working of testing equipment
  3. Measurement using Multimeter & Clamp meter
  4. Battery health check-up
  5. Measure and test the voltage of given cells.

(5.VP.02) Electronic Measurement and Instrumentation -I (Lab)

  1. Study of semiconductor diode voltmeter and its use as DC average responding AC voltmeter.
  2. Study of L.C.R. bridge and determination of the value of the given components.
  3. Study of distortion factor meter and determination of the % distortion of the given oscillator.
  4. Study of the transistor tester and determination of the parameters of the given transistors.

Level 5 (Semester II)

(5.GV.05) Electronic Measurements and Instrumentation – II

Voltmeter and ammeter methods, Wheatstone bridge, low resistance measurements, low resistance measuring instruments AC bridge theory, capacitance bridges, Inductance bridges, Q meter

CRO: CRT, wave form display, time base, dual trace oscilloscope, measurement of

voltage, frequency and phase by CRO, Oscilloscope probes, Oscilloscope specifications and performance. Delay time based Oscilloscopes, Sampling Oscilloscope, DSO, DSO applications Instrument calibration: Comparison method, digital multimeters as standard

instrument, calibration instrument Recorders: X-Y recorders, plotters

Reference Books:

  1. Electronic Measurement & Instrumentation, J.G. Joshi, Khanna Publishing House

(5.GV.06) Identification of Components, Tools, SOP & Work Instructions-II

  1. Introduction to wireless communication
    1. Signal Converters
    1. Tools & their Uses
      1. Use of tester to monitor AC Power
      1. Skin the electrical wires/cables using the wire stripper and cutter
      1. Main cable for control & electronic circuit wires
      1. Crimping tools and buses
  • Introduction to measuring equipment’s
    • Signal generator’s
    • CRO
    • Function Generators
    • Frequency Counter
    • Logic analyzer
    • Spectrum analyzer
    • LCRQ Meter
  • Standard Operating Procedures and Work Instructions
    • What is SOP and WI
    • How to read & follow SOP and WI
    • Overall Quality Assurance Plan

(5.GV.07) Tools, Equipment & Safety Measures-II

  1. Tools & Equipment
    1. Types of tools & equipment required and deployed in manufacturing, installing & servicing
    1. Identification and termination process
  • General maintenance of tools/equipment and recalibration of Test equipment
    • General safety and common-sense safety
  • PPE
    • Usage & benefits of PPE
    • Types & usage of various PPE
    • Maintenance of PPE
  • Clean Room Environment
    • Do’s and Don’t
    • Shop Floor Discipline

(5.GV.08) Soldering & De-soldering components & Emergency actions

  1. Introduction to SMD Components
  • Identification of 2, 3, 4 terminal SMD components
    • Soldering the SMD components on the PCB
    • Make the necessary settings on SMD soldering station to solder various ICs of different packages by choosing proper clamping tools
    • Identify various connections and the setup required for SMD soldering station
    • De solder the SMD components from the given PCB
    • Make the necessary settings on SMD soldering station to de solder various ICs of different packages by choosing proper clamping tools
    • Make a panel board using different types of switches for a given application
    • Identification of crimping tools for various IC packages
    • Reliable Soldering Practices
  • Emergency actions
    • Minimum Requirements
    • Reporting Emergencies
    • Emergency exits
    • Primary and secondary evacuation routes
    • Locations of fire extinguishers
    • Fire alarm pull stations’ location
    • Assembly points
    • Medical Services

(5.VP.03) Soldering & De-soldering components – II Lab

  1. Assemble the product
  2. Dis-assemble the product
  3. Safety Precautions & emergency plans

(5.VP.04) Electronic Measurement-II Lab

  1. Study of the following transducer (i) PT-100 trans (ii) J- type trans. (iii) K-type trans (iv) Presser trans
  2. Measurement of phase difference and frequency using CRO (lissajous figure)
  3. Measurement of low resistance Kelvin’s double bridge.
  4. Radio Receiver Measurements

Level 6 (Semester I)

(6.GV.01) Fault Analysis & Repairs

  1. Classification of fault
  2. Identification of fault
  3. Rectification of fault
  4. Repairing/Replacing Module
  5. Analysis for the different types of equipment’s
    1. Smartphones
    1. Air Conditioning
    1. Security systems
    1. Electronically controlled doors
  6. Fault analysis based on hardware and software component
  7. Diagnostic and Testing Methods
  8. Visual Inspection
  9. Earth Continuity Test
  10. Insulation Resistance Test

(6.GV.02) Good Manufacturing Concept & Practices – I

  • TQM (Total Quality Management) & Kaizen
  • Inventory Management & Logistics in brief
  • Quality assurance
  • Checklist
  • SWOT analysis
  • Lean Manufacturing
  • Muda, Mura & Muri – Toyota Production System (TPS)
  • Spatial considerations & other related concepts

(6.GV.03) Electronics Devices Circuit-I

Unit I

Energy Bands and Charge Carrier in Semiconductor: Bonding forces and energy bands in solids, Charge Carriers in Semiconductors, Carrier Concentrations, Drift Mechanism. Excess carriers in Semiconductors: Optical Absorption, Carrier Lifetime: Direct Recombination, Steady State Carrier Generation, Quasi-Fermi Level, Diffusion of carriers and Einstein relation.

UNIT II Junctions: Equilibrium Conditions, Forward and Reveres Biased Junctions; Steady State Conditions. Optoelectronic Devices: Photodiode V-I characteristic, Photodetector, Solar Cells, Light Emitting Diode.

Reference Books:

1. Analog Electronics, A.K Maini, Khanna Publishing House

(6.GV.04) Electronics System Packaging and Manufacturing

Evolution and Classification of Printed Circuit Boards, Challenges in Modern PCB Design and Manufacture, PCB fabrication methodologies (SSB, DSB and multilayer board), PCB design considerations/ design rules for analog, digital and power applications, Electromagnetic interference in electronic systems and its impact. Analysis of electronic circuit from noise emission point of view (both conducted and radiated emission) cross talk and reflection behavior of the circuit in time domain, Thermal management of electronic devices and systems.

Semiconductor Packages: Single chip packages or modules. (SCM) Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM)-types; System-in package (SIP); Packaging roadmaps; Hybrid circuits. Pipe and FIFOs, Shared memory, Sockets

(6.VP.01) Electronic Devices and Circuits Lab

  1. Study of Lab Equipments and Components: CRO, Multimeter, and Function Generator, Power supply- Active, Passive Components and Bread Board.
  2. P-N Junction diode: Characteristics of PN Junction diode – Static and dynamic resistance measurement from graph.
  3. Applications of PN Junction diode: Half & Full wave rectifier- Measurement of Vrms, Vdc, and ripple factor.
  4. Characteristics of Zener diode: V-I characteristics of zener diode, Graphical measurement of forward and reverse resistance.
  5. Application of Zener diode: Zener diode as voltage regulator. Measurement of percentage regulation by varying load resistor.

(6.VP.02) Fault Analysis & Repairs – Lab

  1. Categorization of faults
    1. Hardware/Software, User Induced, Component Failures
    1. L0 to L4 repairs
    1. Testing electrical/electronic components in the product
    1. Troubleshoot and repair of the faults identified in the product
    1. Preventive Maintenance Services

Level 6 (Semester II)

(6.GV.05) Good Manufacturing Concepts & Practices – II

  • Work Study Concepts
    • Method study
    • Work measurement
    • Sequencing of Operations and timing the flow steps
    • Advantages of work study
    • Team Working
      • Forming
      • Storming
      • Norming
      • Performing
      • Adjourning

(6.GV.06) Manufacturing & Quality Norms

  1. Manufacturing & Quality Norms- keep it differently according to all applications
  • Manpower Deployment and Operations as per Work Instructions and criticality of the process Understanding how to form each operation and practical training of operation
    • Understanding accept and reject criterion of a particular operation. Practical training of testing/checking each operation
    • Quality Norms of accept and practical training of electronic equipment’s/Devices Acceptance/Rejection training of various defects
  • Manufacturing & Quality Norms – II
  • Process in packing line-Packing line Operations sequence flow and its importance
    • Quality Systems – Accept, Reject criterion of various tests at OQA
    • Training of Assembly of electronic components – Assemble, Check, test electronic components
    • Various Labels and their Importance – Understanding Labels, Scanning and its importance
    • Packing of components/devices – Various Stages of packing
    • Acceptance, Reject and sampling following QA norms – AQL level, Sampling techniques, as per QA sampling accept, reject numbers

(6.GV.06) Good Manufacturing Concepts & Practices – III

  1. Good Manufacturing Concepts & Practices – II
    1. Brief Introduction
    1. Total Quality Management
      1. ISO Standards
    1. Kaizen
  • Toyota Production System
    • Lean Manufacturing
      • Combination of Inventory
      • Supply Chain
    • Quality and Inspection
      • 3 Sigma and 6 Sigma Orientation

(6.GV.07) Electronic Devices and Circuits –II

UNIT I MOSFET: Device structure and its operation in equilibrium, V-I characteristics. Circuits at DC, MOSFET as Amplifier and switch, Biasing in MOS amplifier circuits, small- signal operation and models, single stage MOS amplifier, MOSFET internal capacitances and high frequency model, frequency response of CS amplifier

UNIT II BJT: Review of device structure operation and V-I characteristics, BJT circuits at DC, BJT as amplifier and switch, biasing in BJT amplifier circuit, small-signal operation and models, single stage BJT amplifier, BJT internal capacitances and high frequency model, frequency response of CE amplifier.

UNIT III Feedback: The general feedback structure, properties of negative feedback, the four basic feedback topologies, the series-shunt feedback amplifier, the series-series feedback amplifier, the shunt-shunt and shunt series feedback amplifier. Oscillators: Basic principles of sinusoidal oscillators, op-amp RC oscillator circuits, LC oscillator.

Reference Books:

1. Analog Electronics, A.K Maini, Khanna Publishing House

(6.VP.03) Electronic Devices and Circuits –II Lab

  1. Characteristic of BJT: BJT in CE configuration- Graphical measurement of hparameters from input and output characteristics. Measurement of Av, AI, Ro and Ri of CE amplifier with potential divider biasing.
  2. Measurement of Operational Amplifier Parameters: Common Mode Gain, Differential Mode Gain, CMRR, Slew Rate.
  3. Applications of Op-amp: Op-amp as summing amplifier, Difference amplifier, Integrator and differentiator.
  4. Field Effect Transistors: Single stage Common source FET amplifier –plot of gain in dB Vs frequency, Measurement of, bandwidth, input impedance, maximum signal handling capacity (MSHC) of an amplifier.
  5. Oscillators: Sinusoidal Oscillatorsa. Wein’s bridge oscillator b. phase shift oscillator.

(6.VP.04) Vocational Practical

  1. Work study concepts
    1. Team work concepts

Level 7 (Semester I)

(7.GV.01) Valuations & Storage

  1. Valuation
    1. Specific Item cost
    1. Weighted average cost
  2. Storage
    1. Stacking Norms
    1. Bin Cards
    1. Stores Layout
    1. Categorization of Materials
      1. Hazardous/Non-Hazardous
      1. Imported/Local
      1. Assembly/ Parts
      1. Consumables
      1. Class A/B/C
      1. Good/defective

(7.GV.02) Shelf Life, Ware House Operations Management & Material Transactions

  1. Shelf Life Management
    1. FIFO
    1. FILO
    1. LIFO
    1. LILO
  2. Material Transactions
    1. Inward
    1. Outward
    1. Suspense
    1. RMA (Return Material Authorization)
    1. Insurance

(7.GV.03) Industrial Electronic Product Design

Development Process, Product Planning & Conceptualization, Product Architecture and Industrial Design, Product Manufacturing & Prototyping, Economic Analysis & Managing Projects. Introduction to 3-D printing and Rapid Prototyping

(7.GV.04) Pre-Production Activities

Pre-Production activities

  • Layout
    • Time Study & Motion Study
    • Two Hand Insertion
    • Non-value adding activities
    • Positioning of Bins
    • Line Balancing

(7.VP.01) Pre-Production Activities Lab

  • Pre-Production activities
    • Two Hand Insertion
    • Positioning of Bins
  • House Keeping
    • 5S

(7.VP.02) Valuations & Storage Lab

  • Categorization of Raw Material & Consumables
    • Hazardous/Non-Hazardous
    • Imported/Local
    • Assembly/Parts
    • Class A/B/C
    • Good/defective
  • Material Transactions
    • Inward
    • Outward
    • Suspense

Level 7 (Semester II)

(7.GV.05) Entrepreneurship/Accounting/Management

  1. Introduction

Meaning and Nature of Management, Management Approaches, Processes, Managerial Skills, Tasks and Responsibilities of a Professional Manager.

2.  Organizational Structure and Process

Organizational Culture and Climate, Managerial Ethos, Organization Structure & Design, and Managerial Communication.

3.  Planning and Controlling

Planning Types and Process, Management by Objectives, Decision-Making Types and Models, Problem Solving Techniques, Controlling: Process and Techniques.

4.  Performance Evaluation Techniques:

Introduction to Budgeting and Budgetary Control; Performance Budgeting; Classification of Budget; Standard Costing and Variance Analysis; Balanced Scorecard; Responsibility Accounting.

5.  Decision Making Techniques:

Cost Volume Profit Analysis; Management Accounting for Decision Making and Control; EVA and Performance Measurement; Introduction to Activity Base Costing, Targeting Costing, Life Cycle Costing; Uniform Costing.

Or

  1. Entrepreneurship: Concept and Definitions; Entrepreneurship and Economic Development; Classification and Types of Entrepreneurs; Entrepreneurial Competencies; Factor Affecting Entrepreneurial Growth – Economic, Non-Economic Factors; EDP Programmes; Entrepreneurial Training; Traits/Qualities of an Entrepreneurs; Entrepreneur; Manager Vs. Entrepreneur.
  2. Opportunity / Identification and Product Selection: Entrepreneurial Opportunity Search and Identification; Criteria to Select a Product; Conducting Feasibility Studies; Project Finalization; Sources of Information.
  3. Small Enterprises and Enterprise Launching Formalities: Definition of Small Scale; Rationale; Objective; Scope; Role of SSI in Economic Development of India; SSI; Registration; NOC from Pollution Board; Machinery and Equipment Selection; Project Report Preparation; Specimen of Project Report; Project Planning and Scheduling using Networking Techniques of PERT / CPM; Methods of Project Appraisal.
  4. Role of Support Institutions and Management of Small Business: Director of Industries; DIC; SIDO; SIDBI; Small Industries Development Corporation (SIDC); SISI; NSIC; NISBUD; State Financial Corporation SIC; Marketing Management; Production Management; Finance Management; Human Resource Management; Export Marketing; Case Studies-At least 4 (four) in whole course